Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Op-amp Current feedback SOIC 8

Output Step – V

SR – Slew Rate –

SLEW RATE

OUTPUT STEP

sµ

G = 5

= ±15

= 375 Ω

= 25°C

1000

2000

3000

4000

5000

6000

7000

8000

0 5 10 15 20 25

= ±15

100 k 1 M 10 M 100 M

= ±15 V

= ±5 V

= 1 kΩ

= 750 Ω

= 2V

Harmonic Distortion – dB

f – Frequency – Hz

2nd HD

3rd HD

HARMONIC DISTORTION

FREQUENCY

–100

–90

–80

–70

–60

–50

–40

–30

–20

THS3061

THS3062

www.ti.com

SLOS394B –JULY 2002–REVISED NOVEMBER 2009

LOW-DISTORTION, HIGH SLEW RATE, CURRENT-FEEDBACK AMPLIFIERS

Check for Samples: THS3061 THS3062

The THS3061 and THS3062 provide well-regulated

FEATURES

ac performance characteristics with power supplies

• Unity Gain Bandwidth: 300 MHz

ranging from ±5-V operation up to ±15-V supplies.

• 0.1-dB Bandwidth: 120 MHz (G = 2)

Most notably, the 0.1-dB flat bandwidth is exceedingly

high, reaching beyond 100 MHz, and the THS306x

• High Slew Rate: 7000 V/μs

has less than 0.3 dB of peaking in the frequency

• HD3 at 10 MHz: –81 dBc (G = 2, R

= 150 Ω)

response when configured in unity gain. The

• High Output Current: ±145 mA into 50 Ω

unity-gain bandwidth of 300 MHz provides excellent

• Power-Supply Voltage Range: ±5 V to ±15 V

distortion characteristics at 10 MHz. The flexibility of

the current-feedback design allows a 220-MHz, –3-dB

bandwidth in a gain of 10, indicating excellent

APPLICATIONS

performance even at high gains.

• High-Speed Signal Processing

The THS306x consumes 8.3 mA per-channel

• Test and Measurement Systems

quiescent current at room temperature, and has the

• VDSL Line Driver

capability of producing up to ±145 mA of output

• High-Voltage ADC Preamplifier

current. The THS3061 is packaged in an 8-pin SOIC

• Video Line Driver

and an 8-pin MSOP with PowerPAD™. The THS3062

is available in an 8-pin SOIC with PowerPAD and an

DESCRIPTION

8-pin MSP with PowerPAD.

The THS3061 (single) and THS3062 (dual) are

space

high-voltage, high slew-rate current feedback

amplifiers utilizing Texas Instruments' BICOM-1

RELATED DEVICES AND DESCRIPTIONS

process. Designed for low-distortion with a high slew

DEVICE DESCRIPTION

rate of 7000 V/μs, the THS306x amplifiers are ideally

Low Distortion

THS3001

suited for applications requiring large, linear output

Current-Feedback Amplifier

signals such as video line drivers and VDSL line

Dual Current-Feedback

THS3112

drivers.

Amplifier With 175 mA Drive

Dual Current-Feedback

THS3122

Amplifier With 350 mA Drive

Wideband Current-Feedback

OPA691

Amplifier with 350 mA Drive

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (33 pages)

PAGE 1
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 LOW-DISTORTION, HIGH SLEW RATE, CURRENT-FEEDBACK AMPLIFIERS Check for Samples: THS3061 THS3062 FEATURES 1 • • • • • • 23 Unity Gain Bandwidth: 300 MHz 0.
PAGE 2
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
THS3061 THS3062 www.ti.
PAGE 4
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS At VS = ±15 V: Rf = 560 Ω, RL = 150 Ω, and G = 2, unless otherwise noted. THS3061, THS3062 TYP PARAMETER OVER TEMPERATURE TEST CONDITIONS +25°C +25°C 0°C to +70°C –40°C to +85°C UNITS MIN/ TYP/ MAX MHz Typ AC PERFORMANCE Small-signal bandwidth (VO = 100 mVPP, Peaking < 0.3 dB) G = 1, Rf = 750Ω 300 G = 2, Rf = 560 Ω 275 G = 5, Rf = 357 Ω 260 G = 10, Rf = 200 Ω 220 Bandwidth for 0.
PAGE 5
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 ELECTRICAL CHARACTERISTICS (continued) At VS = ±15 V: Rf = 560 Ω, RL = 150 Ω, and G = 2, unless otherwise noted. THS3061, THS3062 TYP PARAMETER OVER TEMPERATURE TEST CONDITIONS +25°C +25°C 0°C to +70°C –40°C to +85°C ±13.7 ±13.4 ±13.4 ±13.3 ±13 ±12.6 ±12.4 ±12.
PAGE 6
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS At VS = ±5 V: Rf = 560 Ω, RL = 150 Ω , and G = 2, unless otherwise noted. THS3061, THS3062 TYP PARAMETER OVER TEMPERATURE TEST CONDITIONS +25°C +25°C 0°C to +70°C –40°C to +85°C UNITS MIN/ TYP/ MAX MHz Typ AC PERFORMANCE Small-signal bandwidth (VO = 100 mVPP, peaking < 0.3 dB) G = 1, Rf = 750 Ω 275 G = 2, Rf = 560 Ω 250 G = 5, Rf = 383 Ω 230 G = 10, Rf = 200 Ω 210 Bandwidth for 0.
PAGE 7
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 ELECTRICAL CHARACTERISTICS (continued) At VS = ±5 V: Rf = 560 Ω, RL = 150 Ω , and G = 2, unless otherwise noted. THS3061, THS3062 TYP PARAMETER Current output, sourcing Current output, sinking Closed-loop output impedance OVER TEMPERATURE TEST CONDITIONS RL = 50 Ω G = 1, f = 1 MHz +25°C +25°C 0°C to +70°C –40°C to +85°C UNITS MIN/ TYP/ MAX 63 61 60 59 mA Min –63 –61 –60 –59 mA Min 0.
PAGE 8
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.
PAGE 9
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) SMALL-SIGNAL FREQUENCY RESPONSE SMALL-SIGNAL FREQUENCY RESPONSE 3 3 G = -1 VCC =±5 V RL = 150 Ω VI = 100 mVPP 2 20 1 Gain - dB 19 18 G = 10 VCC =±5 V, ±15 V RL = 150 Ω, 1 kΩ VI = 100 mVPP, 17 Rf 332 Ω 1 0 -1 Rf 560 Ω -2 Rf 511 Ω 1M 10 M 100 M 1G Rf 560 Ω Rf 475 Ω 1M 10 M 100 M 1G 100 k 1M 10 M 100 M f - Frequency - Hz f - Frequency - Hz Figure 12. Figure 13. Figure 14.
PAGE 10
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) HARMONIC DISTORTION vs FREQUENCY -60 2nd HD -70 -80 3rd HD -60 -70 -80 3rd HD 1M 10 M 100 M -100 -60 -70 -80 3rd HD -90 1M 10 M 100 M -100 100 k Figure 23.
PAGE 11
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) OUTPUT IMPEDANCE vs FREQUENCY 10 1 0.1 0.01 1M 10 M 100 M THS3062 50 40 THS3061 20 10 In150 100 50 In+ 1M 10 M 100 M 1G 10 100 k Figure 31. Figure 32.
PAGE 12
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) SLEW RATE vs OUTPUT VOLTAGE SLEW RATE vs OUTPUT STEP 8000 G=1 Rf = 750 Ω RL = 150 Ω TA = 25°C SR - Slew Rate - V/ µ s 2000 VCC = ±15 1500 VCC = ±5 1000 500 6000 5000 VCC = ±15 4000 3000 2000 1000 1 2 3 4 VO - Output Voltage - V 5 0 6 5 Figure 39. OVERDRIVE RECOVERY TIME 3 5 0 0 -1 -1 -2 G=2 VCC = ±5 Rf = 604 Ω RL = 150 Ω -2 -3 -3 0.5 0 1 1.
PAGE 13
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 APPLICATION INFORMATION INTRODUCTION The THS306x is a high-speed operational amplifier configured in a current-feedback architecture. The device is built using Texas Instruments' BiCOM-I process, a 30-V, dielectrically isolated, complementary bipolar process with NPN and PNP transistors possessing fTs of several GHz.
PAGE 14
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com THS3062(a) 0.1 µF en Noiseless + _ eni + 10 µF IN+ eno eRf RS + _ VI+ eRs RS +12 V Rf RLine 2n2 499 Ω 0.1 µF Telephone Line 210 Ω Rg RLine THS3062(b) VI– Figure 49. Noise Model RS + _ eRg IN– 1:n RLine space 2n2 499 Ω 0.1 µF 10 µF space + –12 V space Figure 48.
PAGE 15
THS3061 THS3062 www.ti.com • • • SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 Minimize parasitic capacitance to any ac ground for all signal I/O pins. Parasitic capacitance on the output and input pins can cause instability. To reduce unwanted capacitance, a window around the signal I/O pins should be opened in all of the ground and power planes around those pins. Ground and power planes should be unbroken elsewhere on the board. Minimize the distance (< 0.
PAGE 16
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com leadframe upon which the die is mounted [see Figure 50(a) and Figure 50(b)]. This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see Figure 50(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal pad. 0.205 0.060 0.017 Pin 1 0.013 0.030 0.
PAGE 17
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 POWER DISSIPATION AND THERMAL CONSIDERATIONS To maintain maximum output capability, the THS360x does not incorporate automatic thermal shutoff protection. The designer must ensure that the design does not violate the absolute maximum junction temperature of the device. Failure may result if the absolute maximum junction temperature of +150°C is exceeded. For best performance, design for a maximum junction temperature of +125°C.
PAGE 18
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com Rf Rg Input _ 10 Ω Output THS306x + CLOAD and should not be considered when using a current-feedback amplifier. Because of this, integrators and simple low-pass filters, which are easily implemented on a VFB amplifier, must be designed slightly differently. If filtering is required, simply place an RC-filter at the noninverting terminal of the operational-amplifier (see Figure 54). Rg Rf f Figure 53.
PAGE 19
THS3061 THS3062 www.ti.com SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 If a multiple-pole filter is required, a Sallen-Key filter can work very well with CFB amplifiers. This is because the filtering elements are not in the negative feedback loop and stability is not compromised. Because of their high slew rates and high bandwidths, CFB amplifiers can pass very accurate signals and help minimize distortion. An example is shown in Figure 55.
PAGE 20
THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (October, 2002) to Revision B Page • Updated document format to current standards ................................................................................................................... 1 • Deleted lead temperature specification from Absolute Maximum Ratings table ....................
PAGE 21
PACKAGE OPTION ADDENDUM www.ti.
PAGE 22
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant THS3061DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS3061DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
PAGE 24
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS3061DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 THS3061DR SOIC D 8 2500 367.0 367.0 35.
PAGE 25
PAGE 26
PAGE 27
PAGE 28
PAGE 29
PAGE 30
PAGE 31
PAGE 32
PAGE 33
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.