Datasheet

P
D
+
ǒ
T
MAX
–T
A
q
JA
Ǔ
Where:
P
D
= Maximum power dissipation of THS3001 (watts)
T
MAX
= Absolute maximum junction temperature (150°C)
T
A
= Free-ambient air temperature (°C)
θ
JA
= Thermal coefficient from die junction to ambient air (°C/W)
T
A
− Free-Air Temperature − °C
1
0
−20 20
1.5
0.5
0 40 100−40
60 80
P
D
− Maximum Power Dissipation − W
SOIC-D Package:
θ
JA
= 169°C/W
T
J
= 150°C
No Airflow
THS3001
SLOS217H –JULY 1998–REVISED SEPTEMBER 2009................................................................................................................................................. www.ti.com
THERMAL INFORMATION
The THS3001 incorporates output-current-limiting protection. Should the output become shorted to ground, the
output current is automatically limited to the value given in the data sheet. While this protects the output against
excessive current, the device internal power dissipation increases due to the high current and large voltage drop
across the output transistors. Continuous output shorts are not recommended and could damage the device.
Additionally, connection of the amplifier output to one of the supply rails (±V
CC
) is not recommended. Failure of
the device is possible under this condition and should be avoided. But, the THS3001 does not incorporate
thermal-shutdown protection. Because of this, special attention must be paid to the device's power dissipation or
failure may result.
The thermal coefficient θ
JA
is approximately 169°C/W for the SOIC 8-pin D package. For a given θ
JA
, the
maximum power dissipation, shown in Figure 55, is calculated by the following formula:
Figure 55. Maximum Power Dissipation vs Free-Air Temperature
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