Datasheet

TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
25
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PowerPADt 64-pin TQFP package (continued)
Thermal vias or other
connection-to-ground vias
5.9 mm
minimum
Figure 14. Recommended Pad Size
More information on this package and other requirements for using thermal lands and thermal vias are detailed
in the TI application report PowerPADt Thermally-Enhanced Package, TI literature number SLMA002,
available at www.ti.com.
Table 2 shows the thermal properties of the 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. 64-Pin TQFP (10 mm × 10 mm × 1 mm)/0,5-mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 1)
R
θ
JA
Thermal resistance, junction to ambient
(see Note 1 and Note 2)
75.83°C/W 42.2°C/W 21.47°C/W
R
θ
JC
Thermal resistance, junction to case
(see Note 1 and Note 2)
7.8°/W 0.38°C/W 0.38°C/W
P
D
Power-handling capabilities of package
(see Note 1, Note 2, and Note 3)
0.92 W 1.66 W 3.26 W
NOTES: 1. Specified with the PowerPAD bond pad on the back side of the package soldered to a 2-oz Cu plate PCB thermal plane
2. Airflow is at 0 LFM (no airflow).
3. Specified at 150°C junction temperature and 80°C ambient temperature