Information

TFP403
TI PanelBus™ DIGITAL RECEIVER
SLDS125B − DECEMBER 2000 − REVISED MAY 2011
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
detailed description (continued)
PowerPAD 100-TQFP package
The TFP403 is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD package
is a 14 mm × 14 mm × 1 mm TQFP outline with 0.5 mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to the die mount
pad for enhanced thermal conduction. Soldering the back side of the TFP403 to the application board is not
required thermally, as the device power dissipation is well within the package capability when not soldered.
Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations.
Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the
PowerPAD back side to a PCB ground plane will help to improve EMI, ground bounce, and power supply noise
performance.
Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-PowerPAD
package is included only for reference.
Table 1. TI 100-TQFP (14 × 14 × 1 mm)/0.5 mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
†
Theta-JA
†,‡
45°C/W 27.3°C/W 17.3°C/W
Theta-JC
†,‡
3.11°C/W 0.12°C/W 0.12°C/W
Maximum power dissipation
†,‡,§
1.6 W 2.7 W 4.3 W
†
Specified with 2 oz. Cu PCB plating.
‡
Airflow is at 0 LFM (no airflow)
§
Measured at ambient temperature, T
A
= 70°C.