Information

TFP401
TFP401A
SLDS120E –MARCH 2000–REVISED JULY 2013 www.ti.com
THERMAL INFORMATION (continued)
TFP401, TFP401A
THERMAL METRIC
(1)
PZP UNIT
100 PINS
θ
JCtop
Junction-to-case (top) thermal resistance 12.3 °C/W
θ
JB
Junction-to-board thermal resistance 7.3 °C/W
ψ
JT
Junction-to-top characterization parameter 0.3 °C/W
ψ
JB
Junction-to-board characterization parameter 7.2 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.6 °C/W
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
DD
(DV
DD
, AV
DD
, PV
DD
, OV
DD
) Supply voltage 3 3.3 3.6 V
t
pix
(1)
Pixel time 6.06 40 ns
R
t
Single-ended analog-input termination resistance 45 50 55 Ω
T
A
Operating free-air temperature 0 25 70 °C
(1) t
pix
is the pixel time defined as the period of the RxC clock input. The period of the output clock, ODCK is equal to tpix when in 1-
pixel/clock mode and 2t
pix
when in 2-pixel/clock mode.
DC DIGITAL I/O ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
IH
High-level digital input voltage
(1)
2 DV
DD
V
V
IL
Low-level digital input voltage
(1)
0 0.8 V
ST = high, V
OH
= 2.4 V 5 10 14
I
OH
High-level output drive current
(2)
mA
ST = low, V
OH
= 2.4 V 3 6 9
ST = high, V
OL
= 0.8 V 10 13 19
I
OL
Low-level output drive current
(2)
mA
ST = low, V
OL
= 0.8 V 5 7 11
I
OZ
Hi-Z output leakage current PD = low or PDO = low –1 1 μA
(1) Digital inputs are labeled DI in I/O column of Terminal Functions table.
(2) Digital outputs are labeled DO in I/O column of Terminal Functions table.
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