Information

TFP401
TFP401A
www.ti.com SLDS120E –MARCH 2000–REVISED JULY 2013
Table 1. TI 100-TQFP (14 mm × 14 mm × 1 mm) / 0.5-mm Lead Pitch
WITHOUT PowerPAD™ Package, PowerPAD™ Package,
PARAMETER PowerPAD™ NOT CONNECTED TO PCB CONNECTED TO PCB
Package THERMAL PLANE THERMAL PLANE
(1)
Theta-JA
(1) (2)
45°C/W 27.3°C/W 17.3°C/W
Theta-JC
(1)(2)
3.11°C/W 0.12°C/W 0.12°C/W
Maximum power dissipation
(1)(2)(3)
1.6 W 2.7 W 4.3 W
(1) Specified with 2-oz. (0.071 mm thick) Cu PCB plating
(2) Airflow is at 0 LFM (0 m/s) (no airflow).
(3) Measured at ambient temperature, T
A
= 70°C
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