Datasheet

TFP401A-EP

SLDS160A –MARCH 2009– REVISED JULY 2011

www.ti.com

Soldering the back side pad of the device to a thermal land connected to the PCB ground plane is recommended

for electrical and EMI considerations. The thermal land may be soldered to the exposed PowerPAD™ using

standard reflow soldering techniques.

The recommended pad size for the grounded thermal land is 5.6mm sq. minimum, centered in the device land

pattern. When vias are required to ground the land, multiple vias are recommended for a low impedance

connection to the ground plane. Vias in the exposed pad should be small enough or filled to prevent wicking the

solder away from the interface between the package body and the thermal land on the surface of the board

during solder reflow.

More information on this package and other requirements for using thermal lands and thermal vias are detailed in

the TI application report PowerPAD™ Thermally Enhanced Package Application Report, TI literature number

SLMA002, available via the TI Web pages beginning at www.ti.com.

Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD™ package. The 100-TQFP non-

PowerPAD™ package is included only for reference.

Table 1. TI 100-TQFP (14 X 14 X 1 mm)/0.5 mm LEAD PITCH

PowerPAD™ PowerPAD™

WITHOUT

PARAMETER

(1) (2)

NOT CONNECTED TO PCB CONNECTED TO PCB

PowerPAD™

THERMAL PLANE THERMAL PLANE

(1)

Theta-JA 45°C/W 27.3°C/W 17.3°C/W

Theta-JC 3.11°C/W 0.12°C/W 0.12°C/W

Maximum power dissipation

(3)

1.6 W 2.7 W 4.3 W

(1) Specified with 2-oz. Cu PCB plating.

(2) Airflow is at 0 LFM (no airflow)

(3) Measured at ambient temperature, T

= 70°C.