Datasheet

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SLDS119C - MARCH 2000 − REVISED OCTOBER 2003
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TI PowerPAD 100-TQFP package
The TFP101/101A is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD
package is a 14 mm × 14 mm × 1 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD package has a
specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the
same outline. The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly
to the die mount pad for enhanced thermal conduction. Soldering the back side of the TFP101/101A to the
application board is not required thermally as the device power dissipation is well within the package capability
when not soldered.
Soldering the back side of the device to the PCB ground plane is recommended for elctrical considerations.
Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the
PowerPAD back side to a PCB ground plane will help to improve EMI, ground bounce, and power supply noise
performance.
Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-
PowerPAD package is included only for reference.
Table 1. TI 100-TQFP (14 × 14 × 1 mm)/0.5 mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
†
Theta-JA
†,‡
45°C/W 27.3°C/W 17.3°C/W
Theta-JC
†,‡
3.11°C/W 0.12°C/W 0.12°C/W
Maximum power dissipation
†,‡,§
1.6 W 2.7 W 4.3 W
†
Specified with 2 oz. Cu PCB plating.
‡
Airflow is at 0 LFM (no airflow)
§
Measured at ambient temperature, T
A
= 70°C.
Not Recommended for New Designs