Datasheet

TAS5630B
www.ti.com SLES217C –NOVEMBER 2010–REVISED SEPTEMBER 2012
MODE SELECTION PINS
MODE PINS
OUTPUT
ANALOG INPUT DESCRIPTION
CONFIGURATION
M3 M2 M1
0 0 0 Differential 2 × BTL AD mode
0 0 1 — — Reserved
0 1 0 Differential 2 × BTL BD mode
Differential single-
0 1 1 1 × BTL +2 ×SE BD mode, BTL differential
ended
1 0 0 Single-ended 4 × SE AD mode
INPUT_C
(1)
INPUT_D
(1)
1 0 1 Differential 1 × PBTL 0 0 AD mode
1 0 BD mode
1 1 0
Reserved
1 1 1
(1) INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode (1=VREG and 0=AGND).
THERMAL INFORMATION
TAS5630B
THERMAL METRIC
(1)(2)
UNITS
PHD (64 Pins) DKD (44 Pins)
θ
JA
Junction-to-ambient thermal resistance 8.5 9.3
θ
JCtop
Junction-to-case (top) thermal resistance 0.2 0.6
θ
JB
Junction-to-board thermal resistance 20.6 3.7
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2 1.3
ψ
JB
Junction-to-board characterization parameter 0.73 3.5
θ
JCbot
Junction-to-case (bottom) thermal resistance 8.2 19.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Thermal model data was performed using a 40 x 40 x 90mm heat-sink
Table 1. ORDERING INFORMATION
(1)
T
A
PACKAGE DESCRIPTION
0°C–70°C TAS5630BPHD 64-pin HTQFP
0°C–70°C TAS5630BDKD 44-pin PSOP3
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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