Datasheet

TAS5611
www.ti.com SLAS681A –DECEMBER 2009–REVISED APRIL 2010
MODE SELECTION PINS
MODE PINS
OUTPUT
ANALOG INPUT DESCRIPTION
CONFIGURATION
M3 M2 M1
0 0 0 Differential 2 × BTL AD mode
0 0 1 — — Reserved
0 1 0 Differential 2 × BTL BD mode
Differential Single
0 1 1 1 × BTL +2 ×SE BD mode, BTL Differential
Ended
1 0 0 Single Ended 4 × SE AD mode
INPUT_C
(1)
INPUT_D
(1)
1 0 1 Differential 1 × PBTL 0 0 AD mode
1 0 BD mode
1 1 0
Reserved
1 1 1
(1) INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode (1=VREG and 0=GND).
PACKAGE HEAT DISSIPATION RATINGS
(1)
PARAMETER TAS5611PHD TAS5611DKD
R
qJC
(°C/W) – 2 BTL or 4 SE channels 3.2 2.1
R
qJC
(°C/W) – 1 BTL or 2 SE channel(s) 5.4 3.5
R
qJC
(°C/W) – 1 SE channel 7.9 5.1
Pad Area
(2)
64 mm
2
80 mm
2
(1) J
C
is junction-to-case, CH is case-to-heat sink
(2) R
qCH
is an important consideration. Assume a 2-mil thickness of thermal grease with a thermal conductivity of 2.5 W/mK between the
pad area and the heat sink and both channels active. The R
qCH
with this condition is 1.1°C/W for the PHD package and 0.44°C/W for
the DKD package.
Table 1. ORDERING INFORMATION
(1)
T
A
PACKAGE DESCRIPTION
0°C–70°C TAS5611PHD 64 pin HTQFP
0°C–70°C TAS5611DKD 44 pin PSOP3
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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