Datasheet
Table Of Contents
- 1 Overview
- 2 Quick Setup Guide
- 3 Protection
- 4 TAS5352DDV6EVM Performance
- 4.1 THD+N vs Power (BTL – 4 )
- 4.2 THD+N vs Power (BTL – 6 )
- 4.3 THD+N vs Power (BTL – 8 )
- 4.4 THD+N vs Power (PBTL – 2 )
- 4.5 THD+N vs Power (PBTL – 3 )
- 4.6 THD+N vs Frequency (BTL –4 )
- 4.7 THD+N vs Frequency (BTL –6 )
- 4.8 THD+N vs Frequency (BTL –8 )
- 4.9 THD+N vs Frequency (PBTL – 2 )
- 4.10 THD+N vs Frequency (PBTL – 3 )
- 4.11 FFT Spectrum With –60-dBFS Tone (BTL)
- 4.12 FFT Spectrum With –60-dBFS Tone (PBTL)
- 4.13 Idle Noise FFT Spectrum (BTL)
- 4.14 Idle Noise FFT Spectrum (PBTL)
- 4.15 Channel Separation
- 4.16 Frequency Response (BTL)
- 4.17 Frequency Response (PBTL)
- 4.18 High-Current Protection (BTL)
- 4.19 High-Current Protection (PBTL)
- 4.20 Pop/Click (BTL)
- 4.21 Pop/Click (PBTL)
- 4.22 Output Stage Efficiency
- 4.23 Subwoofer Lineout THD vs Output Voltage
- 4.24 Subwoofer Lineout THD+N vs Frequency
- 4.25 Subwoofer Lineout Frequency Response
- 5 Related Documentation from Texas Instruments
- Appendix A Design Documents
TI A831-PCBSPEC-001(1.00)
Jonas Holm
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TAS5352DDV6EVM (A831)
PCB SPECIFICATION
Version 1.00
BOARD IDENTIFICATION: A831-PCB-001(1.00)
BOARD TYPE: DOUBLE-SIDED PLATED-THROUGH BOARD
LAMINATE TYPE: FR4
LAMINATE THICKNESS: 1.6 mm
COPPER THICKNESS: 70 μm (INCL. PLATING EXTERIOR LAYER)
COPPER PLATING OF HOLES: >25 μm
MINIMUM HOLE DIAMETER 0.3 mm
SILKSCREEN COMPONENT SIDE: WHITE - REMOVE SILKSCREEN FROM SOLDER AREA & PRE-TINNED AREAS
SILKSCREEN SOLDER SIDE: None
SOLDER MASK COMPONENT SIDE: GREEN
SOLDER MASK SOLDER SIDE: GREEN
PROTECTIVE COATING: SOLDER COATING AND CHEMICAL SILVER ON FREE COPPER
ELECTRICAL TEST: PCB MUST BE ELECTRICAL TESTED
MANUFACTURED TO: PERFAG 2E (www.perfag.dk)
APERTURE TABLE: PERFAG 10A (www.perfag.dk)
BOARD SIZE: 114 x 149 mm
COMMENTS: SEE DRILL INFORMATION FILE (PCBDOC.ZIP).