Datasheet

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PACKAGE HEAT DISSIPATION RATINGS
(1)
ABSOLUTE MAXIMUM RATINGS
TAS5186A
SLES156 – OCTOBER 2005
Table 1. MODE Selection Pins
MODE PINS
(1)
MODE
M2 M3 NAME DESCRIPTION
0 0 2.1 mode Channels A, B, and C enabled; channels D, E, and F disabled
0 1 5.1 mode All channels enabled
1 0/1 Reserved
(1) M1 must always be connected to GND. 0 indicates a pin connected to GND; 1 indicates a pin connected to VREG.
PARAMETER TAS5186ADDV
R
θ JC
( ° C/W)—1 satellite (sat.) FET only 10.3
R
θ JC
( ° C/W)—1 subwoofer (sub.) FET only 5.2
R
θ JC
( ° C/W)—1 sat. half-bridge 5.2
R
θ JC
( ° C/W)—1 sub. half-bridge 2.6
R
θ JC
( ° C/W)—5 sat. half-bridges + 1 sub. 1.74
Typical pad area
(2)
34.9 mm
2
(1) JC is junction-to-case, CH is case-to-heatsink.
(2) R
θ CH
is an important consideration. Assume a 2-mil thickness of typical thermal grease between the pad area and the heatsink. The
R
θ CH
with this condition is typically 2°C/W for this package.
over operating free-air temperature range (unless otherwise noted)
(1)
TAS5186A
VDD to AGND –0.3 V to 13.2 V
GVDD_X to AGND –0.3 V to 13.2 V
PVDD_X to PGND_X
(2)
–0.3 V to 50 V
OUT_X to PGND_X
(2)
–0.3 V to 50 V
BST_X to PGND_X
(2)
–0.3 V to 63.2 V
VREG to AGND –0.3 V to 4.2 V
PGND to GND –0.3 V to 0.3 V
PGND to AGND –0.3 V to 0.3 V
GND to AGND –0.3 V to 0.3 V
PWM_X, OC_ADJ, M1, M2, M3 to AGND –0.3 V to 4.2 V
RESET, SD, OTW to AGND –0.3 V to 7 V
Maximum operating junction temperature range (T
J
) 0 to 125°C
Storage temperature –40°C to 125°C
Lead temperature – 1,6 mm (1/16 inch) from case for 10 seconds 260°C
Minimum PWM pulse duration, low 30 ns
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These voltages represent the dc voltage + peak ac waveform measured at the terminal of the device in all conditions.
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