Datasheet

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DEVICE INFORMATION
TERMINAL ASSIGNMENT
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PGND
PWM_F
GVDD_DEF
VDD
PWM_E
PWM_D
RESET
M3
M2
M1
GND
AGND
VREG
OC_ADJ
SD
OTW
PWM_C
PWM_B
PWM_A
GVDD_ABC
BST_BIAS
OUT_BIAS
BST_F
PVDD_F
OUT_F
PGND
OUT_E
PVDD_E
BST_E
BST_D
PVDD_D
OUT_D
PGND
PGND
OUT_C
PVDD_C
BST_C
BST_B
PVDD_B
OUT_B
PGND
OUT_A
PVDD_A
BST_A
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P0016-02
TAS5176
SLES196 – JUNE 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The TAS5176 is available in a thermally enhanced 44-pin HTSSOP PowerPAD™ package. The heat slug is
located on the bottom side of the device for convenient thermal coupling to the printed circuit board which is
used as the heatsink for this device.
DDW PACKAGE
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