Datasheet

TAS5112A
SLES094B - OCTOBER 2003 - REVISED JUNE 2008
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20
Aluminum Chassis 7.2 in. y 1 in. y 0.1 in. Thick
Sides of U-Shaped Chassis Are 1.25 in. High (3.9°C/W)
56-Pin DCA Package
(1.145C/W)
Insulating
Back Panel
Insulating
Front Panel
Stereo
Amplifier
Board
Wakefield Type 126
Thermal Compound
Under Via Pads
(3.2°C/W)
Wakefield Type 126
Thermal Compound
(0.1°C/W)
8-mm y 10-mm y 40-mm
Aluminum Bar
(0.09°C/W)
1 mm
Plastic Top
PCB (3.65C/W)
Figure 15. 56-Pin DCA Package Cross-Sectional View (Side)
Aluminum Chassis 7.2 in. y 1 in. y 0.1 in. Thick
Sides of U-Shaped Chassis Are 1.25 in. High (3.9°C/W)
8-mm y 10-mm y 40-mm
Aluminum Bar
(0.09°C/W)
Plastic Top
Wakefield Type 126
Thermal Compound
(0.1°C/W)
56-Pin DCA Package
(1.14°C/W)
(2 Places)
PCB (3.6°C/W)
Wakefield Type 126
Thermal Compound
Under Via Pads
(3.2°C/W)
4-40 Machine Screw
With Star Washer
and Nut
(3 Places)
Stereo
Amplifier
Board
Figure 16. Spatial Separation With Multiple Packages
The land pattern recommendation shown in Figure 14 is
for optimal performance with aluminum bar thermal
resistance of 0.09°C/W. The following table shows the
decrease in thermal resistance through the PCB with a
corresponding increase in the land pattern size. Use the
table for thermal design tradeoffs.