Datasheet

TAS5112A
SLES094B - OCTOBER 2003 - REVISED JUNE 2008
www.ti.com
18
Thermal
Pad
8,20 mm
7,20 mm
3,90 mm
2,98 mm
DCA THERMAL INFORMATION
The thermally enhanced DCA package is based on the
56-pin HTSSOP, but includes a thermal pad (see
Figure 14) to provide an effective thermal contact between
the IC and the PCB.
The PowerPAD™ package (thermally enhanced
HTSSOP) combines fine-pitch, surface-mount technology
with thermal performance comparable to much larger
power packages.
The PowerPAD package is designed to optimize the heat
transfer to the PWB. Because of the small size and limited
mass of an HTSSOP package, thermal enhancement is
achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is
formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to
the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipater,
high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Thermal Methodology for the DCA 56-Pin,
2y15-W, 8-W Package
The thermal design for the DCA part (e.g., thermal pad
soldered to the board) should be similar to the design in the
following figures. The cooling approach is to conduct the
dissipated heat into the via pads on the board, through the
vias in the board, and into a heatsink (aluminum bar) (if
necessary).
Figure 14 shows a recommended land pattern on the
PCB.