Datasheet
TAS2521
SLAS687A –FEBRUARY 2013–REVISED FEBRUARY 2013
www.ti.com
Table 2-1. RGE PIN FUNCTIONS (continued)
PIN
I/O
(1)
DESCRIPTION
NAME NO.
MISO 17 O SPI Serial Data Output
GPIO/DOUT 18 I/O/Z GPIO / Audio Serial Bus Output
SCL/SSZ 19 I Either I2C Input Serial Clock or SPI Chip Select Signal depending on SPI_SEL state
SDA/MOSI 20 I Either I2C Serial Data Input or SPI Serial Data Input depending on SPI_SEL state.
SCLK 21 I Serial clock for SPI interface
IOVDD 22 PWR I/O Power Supply, 1.1V - 3.6V
DVDD 23 PWR Digital Power Supply, 1.65V - 1.95V
DVSS 24 GND Digital Ground, 0V
3 ELECTRICAL SPECIFICATIONS
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN MAX
AVDD to AVSS –0.3 2.2 V
DVDD to DVSS –0.3 2.2 V
SPKVDD to SPKVSS –0.3 6 V
IOVDD to IOVSS –0.3 3.9 V
Digital input voltage IOVSS – 0.3 IOVDD + 0.3 V
Analog input voltage AVSS – 0.3 AVDD + 0.3 V
Operating temperature range –40 85 °C
Storage temperature range –55 150 °C
Junction temperature (T
J
Max) 105 °C
QFN Power dissipation(with thermal pad soldered to board) (T
J
Max – T
A
) / θ
JA
W
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
3.2 THERMAL INFORMATION
TAS2521
THERMAL METRIC
(1)
UNITS
RGE (24 PINS)
θ
JA
Junction-to-ambient thermal resistance 32.2
θ
JCtop
Junction-to-case (top) thermal resistance 30.0
θ
JB
Junction-to-board thermal resistance 9.2
°C/W
ψ
JT
Junction-to-top characterization parameter 0.3
ψ
JB
Junction-to-board characterization parameter 9.2
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
4 ELECTRICAL SPECIFICATIONS Copyright © 2013, Texas Instruments Incorporated
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