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SN75LVCP600S EVM Board Construction

3 SN75LVCP600S EVM Board Construction

The SN75LVCP600S EVM board is a 6-layer board constructed of FR4 – 370 material. The board stackup

consists of a signal layer on top, ground layer, power layer, two ground layers and a signal layer on

bottom.

The high-speed data signals of this board were routed as single-ended 50-Ω transmission lines, the

differential routing of these signals with 100-Ω impedance matching can be implemented as well.

Figure 11. SN75LVCP600S EVM Board Stack-Up

SLLU144–March 2011 SN75LVCP600S EVMPCB Construction

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