Datasheet

SN75LVCP600S
SLLSE81 MARCH 2011
www.ti.com
THERMAL INFORMATION
SN75LVCP600S
THERMAL METRIC
(1)
UNITS
DSK (10) PINS
θ
JA
Junction-to-ambient thermal resistance 55.7
θ
JCtop
Junction-to-case (top) thermal resistance 61.9
θ
JB
Junction-to-board thermal resistance 29.2
°C/W
ψ
JT
Junction-to-top characterization parameter 1.0
ψ
JB
Junction-to-board characterization parameter 29.3
θ
JCbot
Junction-to-case (bottom) thermal resistance 9.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
typical values for all parameters are at V
CC
= 3.3 V and T
A
= 25°C; all temperature limits are specified by design
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
V
CC
Supply voltage 3 3.3 3.6 V
C
COUPLING
Coupling capacitor 12 nF
T
A
Operating free-air temperature 40 85 °C
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
DEVICE PARAMETERS
ICC
Max
Active mode supply current MODE/EQ/DE/SQ_TH = NC, K28.5 pattern at 6Gbps, V
ID
29 41 mA
= 700mV
pp
, (SATA mode)
MODE/EQ/DE/SQ_TH = V
CC
, K28.5 pattern at 6Gbps, V
ID
32 45
= 700mV
pp
, (SAS mode)
I
CCPS
Auto power save mode I
CC
When auto low power conditions are met 3.3 5.0 mA
Maximum data rate 6.0 Gbps
t
PDelay
Propagation delay Measured using K28.5 pattern, See Figure 8 280 330 ps
AutoLP
ENTRY
Auto low power entry time Electrical idle at input, See Figure 10 11 20 μs
AutoLP
EXIT
Auto low power exit time After first signal activity, See Figure 10 30 40 ns
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