Datasheet

OUT-OF-BAND (OOB) SUPPORT
DEVICE POWER
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
SN75LVCP422
SLLS972 – MARCH 2009 ................................................................................................................................................................................................... www.ti.com
– The device enters and exits low power mode by actively monitoring the input signal (V
IDp-p
) level on each
of its channels independently. When the input signal on either or both channels is in the electrical idle
state, i.e. V
IDp-p
< 50 mV, and stays in this state for > 3 µ s, the associated channel(s) enters the low power
state. In this state, the output of the associated channel(s) is driven to V
CM
, and the device selectively
shuts off some circuitry to lower power by up to 20% of its normal operating power. Exit time from auto
low power mode is less than 50 ns.
– As an example, if under normal operating conditions the device is consuming typical power of 200 mW,
when the device enters this mode, i.e. the condition for auto-low power mode is met, power consumption
can drop down to 160 mW. The device enters normal operation within 50 ns of signal activity detection.
The squelch detector circuit within the device enables full detection of OOB signaling as specified in SATA
specification 2.6. Differential signal amplitude at the receiver input of 50 mV
p-p
or less is not detected as an
activity and hence is not passed to the output. Differential signal amplitude of 150 mV
p-p
or more is detected as
an activity and therefore passed to the output indicating activity. Squelch circuit on/off time is 5 ns maximum.
While in squelch mode outputs are held to V
CM
.
The SN75LVCL412 is designed to operate from a single 3.3-V supply. Always practice proper power supply
sequencing procedures. Apply V
CC
first before any input signals are applied to the device. The power down
sequence is in reverse order.
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
Supply voltage range
(2)
V
CC
– 0.5 to 6 V
Voltage range Differential I/O – 0.5 to 4 V
Control I/O – 0.5 to V
CC
+ 0.5 V
Electrostatic discharge Human body model
(3)
± 8000 V
Charged-device model
(4)
± 1500 V
Machine model
(5)
± 200 V
Continuous power dissipation See Dissipation Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A.
(5) Tested in accordance with JEDEC Standard 22, Test Method A115-A.
PCB JEDEC DERATING FACTOR
(1)
T
A
= 85 ° C
PACKAGE T
A
≤ 25 ° C
STANDARD ABOVE T
A
= 25 ° C POWER RATING
20-pin SSOP (DB) Low-K 952 mW 9.52 mW/ ° C 381 mW
High-K 1149 mW 11.49 mW/ ° C 460 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN75LVCP422