Datasheet

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SLLS173F − JANUARY 1994 − REVISED APRIL 2006
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL CHARACTERISTICS − D PACKAGE
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Junction−to−ambient thermal reisistance, θ
JA
†
Low-K board, no air flow 199.4
Junction−to−ambient thermal reisistance, θ
JA
†
High-K board, no air flow 119
°C/W
Junction−to−board thermal reisistance, θ
JB
High-K board, no air flow 67
°C/W
Junction−to−case thermal reisistance, θ
JC
46.6
Average power dissipation, P
(AVG)
R
L
= 54 Ω, input to D is 10 Mbps 50% duty
cycle square wave, V
CC
= 5.25 V, T
J
= 130
°C.
330 mW
Thermal shutdown junction temperature, T
SD
165 °C
†
See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.