Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

74LVCC3245ADBQRE4 ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVCC3245A

74LVCC3245ADBQRG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVCC3245A

SN74LVCC3245ADBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI -40 to 85

SN74LVCC3245ADBQR ACTIVE SSOP DBQ 24 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVCC3245A

SN74LVCC3245ADBR ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH245A

SN74LVCC3245ADBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH245A

SN74LVCC3245ADBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH245A

SN74LVCC3245ADW ACTIVE SOIC DW 24 25 Green (RoHS

& no Sb/Br)