Datasheet
www.ti.com
FEATURES
DB, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OEBA1
A1
A2
A3
A4
A5
A6
A7
A8
A9
OEBA2
GND
V
CC
B1
B2
B3
B4
B5
B6
B7
B8
B9
OEAB2
OEAB1
DESCRIPTION/ORDERING INFORMATION
SN74LVC863A
9-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS310J – MARCH 1993 – REVISED MARCH 2005
• Operates From 1.65 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Max t
pd
of 6.1 ns at 3.3 V
• Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25 ° C
• Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25 ° C
• Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With
3.3-V V
CC
)
• I
off
Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
This 9-bit bus transceiver is designed for 1.65-V to 3.6-V V
CC
operation.
The SN74LVC863A is designed for asynchronous communication between data buses. The control-function
implementation allows for maximum flexibility in timing.
This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic levels at the output-enable ( OEAB and OEBA) inputs.
The outputs are in the high-impedance state during power-up and power-down conditions. The outputs remain in
the high-impedance state while the device is powered down.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 25 SN74LVC863ADW
SOIC – DW LVC863A
Reel of 2000 SN74LVC863ADWR
SOP – NS Reel of 2000 SN74LVC863ANSR LVC863A
SSOP – DB Reel of 2000 SN74LVC863ADBR LC863A
–40 ° C to 85 ° C
Tube of 60 SN74LVC863APW
TSSOP – PW Reel of 2000 SN74LVC863APWR LC863A
Reel of 250 SN74LVC863APWT
TVSOP – DGV Reel of 2000 SN74LVC863ADGVR LC863A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1993–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.