Datasheet

1
FEATURES
Seemechanicaldrawingfordimensions.
DCUPACKAGE
(TOP VIEW)
3 6
3A2A
8
1
V
CC
1A
5
GND
4
2Y
2
7
1Y3Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC3G07-Q1
www.ti.com .................................................................................................................................................... SCES616B – OCTOBER 2004 – REVISED APRIL 2008
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
• Qualified for Automotive Applications • Typical V
OHV
(Output V
OH
Undershoot) >2 V at
V
CC
= 3.3 V, T
A
= 25 ° C
• Supports 5-V V
CC
Operation
• I
off
Supports Partial-Power-Down Mode
• Max t
pd
of 3.7 ns at 3.3 V
Operation
• Low Power Consumption, 10- µ A Max I
CC
• Latch-Up Performance Exceeds 100 mA Per
• ± 24-mA Output Drive at 3.3 V
JESD 78, Class II
• Input and Open-Drain Output Accepts
• ESD Protection Exceeds JESD 22
Voltages up to 5.5 V
– 2000-V Human-Body Model (A114-A)
• Typical V
OLP
(Output Ground Bounce) <0.8 V at
– 200-V Machine Model (A115-A)
V
CC
= 3.3 V, T
A
= 25 ° C
– 1000-V Charged-Device Model (C101)
This triple buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
– 40 ° C to 125 ° C VSSOP – DCU Reel of 3000 SN74LVC3G07QDCURQ1 C07_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT OUTPUT
A Y
H H
L L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.