Datasheet

Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).
3. Product disclaimer applies to DCU package 150°C.
0.10
1.00
10.00
100.00
1000.00
80 90 100 110 120 130 140 150 160 170 180
Continuous T
A
(°C)
Estimated Life (Years)
Wirebond Voiding Fail Mode
Electromigration Fail Mode
SN74LVC2T45-EP
SCES777C –NOVEMBER 2008–REVISED JULY 2010 www.ti.com
Figure 1. LVC2T45SDCU Operating Life Derating Chart
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Product Folder Link(s): SN74LVC2T45-EP