Datasheet

1
FEATURES
3
2
4
61
1A 1Y
2Y
GND
2A
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
61
1A 1Y
2Y
GND
2A
See mechanical drawings for dimensions.
V
CC
V
CC
5
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G14-Q1
www.ti.com ............................................................................................................................................................. SCES558D – JULY 2004 – REVISED APRIL 2008
DUAL SCHMITT-TRIGGER INVERTER
• Qualified for Automotive Applications • Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25 ° C
• Supports 5-V V
CC
Operation
• I
off
Feature Supports Partial-Power-Down Mode
• Inputs Accept Voltages to 5.5 V
Operation
• Max t
pd
of 5.4 ns at 3.3 V
• Latch-Up Performance Exceeds 100 mA Per
• Low Power Consumption, 10- µ A Max I
CC
JESD 78, Class II
• ± 24-mA Output Drive at 3.3 V
• ESD Protection Exceeds JESD 22
• Typical V
OLP
(Output Ground Bounce)
– 2000-V Human-Body Model (A114-A)
<0.8 V at V
CC
= 3.3 V, T
A
= 25 ° C
– 1000-V Charged-Device Model (C101)
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions as
two independent inverters, but because of Schmitt action, it may have different input threshold levels for
positive-going (V
T+
) and negative-going (V
T –
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SOT (SOT-23) – DBV Tape and reel SN74LVC2G14IDBVRQ1 C14_
– 40 ° C to 85 ° C
SOT (SC-70) – DCK Tape and reel SN74LVC2G14IDCKRQ1 CF_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.