Datasheet

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PACKAGE OUTLINE
C
0.5 MAX
0.19
0.15
1
TYP
0.5 TYP
6X
0.25
0.21
0.5
TYP
B E
A
D
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFree
TM
package configuration.
NanoFree Is a trademark of Texas Instruments.
BALL A1
CORNER
SEATING PLANE
BALL TYP
0.05 C
B
A
1
2
0.015 C A B
SYMM
SYMM
C
SCALE 9.000
D: Max =
E: Max =
1.418 mm, Min =
0.918 mm, Min =
1.358 mm
0.858 mm