Datasheet

B
C
A
1
4
2
SN74LVC1G66
SCES323N –JUNE 2001–REVISED NOVEMBER 2012 www.ti.com
Table 1. ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Reel of 3000 SN74LVC1G66YZPR _ _ _C6_
free)
Reel of 3000 SN74LVC1G66DBVR
SOT (SOT-23) – DBV C66_
Reel of 250 SN74LVC1G66DBVT
Reel of 3000 SN74LVC1G66DCKR
–40°C to 85°C
Reel of 250 SN74LVC1G66DCKT
SOT (SC-70) – DCK
C6_
Jumbo Reel of
SN74LVC1G66DCKJ
10000
SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G66DRLR
QFN – DRY Reel of 5000 SN74LVC1G66DRYR
C6
µQFN – DSF Reel of 5000 SN74LVC1G66DSFR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUT SWITCH
(C)
L OFF
H ON
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Links: SN74LVC1G66