Datasheet

SN74LVC1G38
SCES538C –JANUARY 2004– REVISED MARCH 2011 www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoStar™ – WCSP (DSBGA)
SN74LVC1G38YEPR
0.23-mm Large Bump – YEP
Reel of 3000 _ _ _D7_
NanoFree™ – WCSP (DSBGA)
SN74LVC1G38YZPR
0.23-mm Large Bump – YZP (Pb-free)
SON – DSF Reel of 5000 SN74LVC1G38DSFR D7
–40°C to 85°C
SON – DRY Reel of 5000 SN74LVC1G38DRYR D7
Reel of 3000 SN74LVC1G38DBVR
SOT (SOT-23) – DBV C38_
Reel of 250 SN74LVC1G38DBVT
Reel of 3000 SN74LVC1G38DCKR
SOT (SC-70) – DCK D7_
Reel of 250 SN74LVC1G38DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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Product Folder Link(s): SN74LVC1G38