Datasheet

B2
S
1
4
6
A
3
B1
SN74LVC1G3157
SCES424H –JANUARY 2003–REVISED MAY 2012 www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC1G3157YZPR _ _ _ C5_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY Reel of 5000 SN74LVC1G3157DRYR C5
SON – DSF Reel of 5000 SN74LVC1G3157DSFR C5
–40°C to 85°C
SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G3157DBVR CC5_
SOT (SC-70) – DCK Reel of 3000 SN74LVC1G3157DCKR C5_
SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G3157DRLR C5_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Table 1. FUNCTION TABLE
CONTROL
ON
INPUT
CHANNEL
S
L B1
H B2
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Link(s): SN74LVC1G3157