Datasheet

Y
0
Y
1
SN74LVC1G19
SCES464F –JUNE 2003–REVISED JULY 2012 www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
SN74LVC1G19YZPR
NanoFree™ – WCSP (DSBGA)
Reel of 3000 _ _ _CY_
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G19YZPRB
SON – DRY Reel of 4000 SN74LVC1G19DRYR CY
SN74LVC1G19DBVR
SOT (SOT-23) – DBV Reel of 3000 C19_
SN74LVC1G19DBVRE4
–40°C to 85°C
SN74LVC1G19DCKR
SOT (SC-70) – DCK Reel of 3000 SN74LVC1G19DCKRE4 CY_
SN74LVC1G19DCKRG4
SN74LVC1G19DRLR
SOT (SOT-553) – DRL Reel of 4000 CY_
SN74LVC1G19DRLRG4
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Table 1. FUNCTION TABLE
INPUTS OUTPUTS
E A Y
0
Y
1
L L L H
L H H L
H X H H
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Link(s): SN74LVC1G19