Datasheet

See mechanical drawings for dimensions.
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
2
GND
V
CC
5
3
4
A
Y
1
6
1
S
Y
0
3
4
A
2
GND
Y
1
5
1
S
V
CC
6
Y
0
2
GND
V
CC
1
5
S
A
4
3
Y
1
6
Y
0
DRY PACKAGE
(TOP VIEW)
GND V
CC
S
6
5
4
2
3
A
Y
1
Y
0
1
S
A
DSF PACKAGE
(TOP VIEW)
GND
Y
0
Y
1
V
CC
6
5
4
2
3
1
SN74LVC1G18
www.ti.com SCES406K –JULY 2002–REVISED JULY 2012
1-OF-2 NONINVERTING DEMULTIPLEXER
WITH 3-STATE DESELECTED OUTPUT
Check for Samples: SN74LVC1G18
1
FEATURES
2
• Available in the Texas Instruments NanoFree™
• I
off
Supports Partial-Power-Down Mode
Package Operation
• Supports 5-V V
CC
Operation • Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• Inputs Accept Voltages to 5.5 V
• ESD Protection Exceeds JESD 22
• Max t
pd
of 3.4 ns at 3.3 V
– 2000-V Human-Body Model (A114-A)
• Low Power Consumption, 10-μA Max I
CC
– 200-V Machine Model (A115-A)
• ±24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
• Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
• Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25°C
DESCRIPTION/ORDERING INFORMATION
This noninverting demultiplexer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data on
input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or
high, respectively.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.