Datasheet

SN74LVC1G17
SCES351T –JULY 2001–REVISED NOVEMBER 2012 www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going
(V
T+
) and negative-going (V
T–
) signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC1G17YZPR _ _ _C7_
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA) _ _ _ _
Reel of 3000 SN74LVC1G17YZVR
0.23-mm Large Bump – YZV (Pb-free) C7
SN74LVC1G17DRYR
QFN – DRY Reel of 5000 C7
SN74LVC1G17DRYRG4
µQFN – DSF Reel of 5000 SN74LVC1G17DSFR C7
SN74LVC1G17DBV3
SN74LVC1G17DBVR
Reel of 3000
SN74LVC1G17DBVRE4
SOT (SOT-23) – DBV C17
SN74LVC1G17DBVRG4
SN74LVC1G17DBVT
Tube of 250
–40°C to 85°C
SN74LVC1G17DBVTE4
SN74LVC1G17DCK3
SN74LVC1G17DCKR
Reel of 3000
SN74LVC1G17DCKRE4
SN74LVC1G17DCKRG4
SOT (SC-70) – DCK C7_
SN74LVC1G17DCKT
Tube of 250
SN74LVC1G17DCKTE4
Jumbo Reel of
SN74LVC1G17DCKJ
10000
SN74LVC1G17DRLR
SOT (SOT-553) – DRL Reel of 4000 C7_
SN74LVC1G17DRLRG4
µSON – DPK Reel of 5000 SN74LVC1G17DPKR C7_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is two lines. Line 1 has four characters to denote year, month, day, and wafer fab/assembly site. Line
2 has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-
free).
2 Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated
Product Folder Links: SN74LVC1G17