Datasheet

Q
1
6
C1
D
CLR
CLK
D
R
3
4
SN74LVC1G175
SCES560E – MARCH 2004 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC1G175YZPR _ _ _D6_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY Reel of 5000 SN74LVC1G175DRYR D6_
Reel of 3000 SN74LVC1G175DBVR
– 40 ° C to 85 ° C
SOT (SOT-23) – DBV C75_
Reel of 250 SN74LVC1G175DBVT
Reel of 3000 SN74LVC1G175DCKR
SOT (SC-70) – DCK D6_
Reel of 250 SN74LVC1G175DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Q
CLR CLK D
H ↑ L L
H ↑ H H
H H or L X Q
O
L X X L
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Link(s): SN74LVC1G175