Datasheet

A Y

2 4

A Y

1 3

SN74LVC1G14

SCES647A –SEPTEMBER 2005– REVISED JUNE 2011

www.ti.com

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(2)

NanoFree™ – WCSP (DSBGA)

Reel of 3000 SN74LVC1G14YZPR _ _ _CF_

0.23-mm Large Bump – YZP (Pb-free)

NanoFree™ – WCSP (DSBGA) _ _ _ _

Reel of 3000 SN74LVC1G14YZVR

0.23-mm Large Bump – YZV (Pb-free) CF

Reel of 3000 SN74LVC1G14DBVR

SOT (SOT-23) – DBV C14_

Reel of 250 SN74LVC1G14DBVT

–40°C to 85°C

Reel of 3000 SN74LVC1G14DCKR

SOT (SC-70) – DCK CF_

Reel of 250 SN74LVC1G14DCKT

SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G14DRLR CF_

µQFN – DSF Reel of 5000 SN74LVC1G14DSFR CF

QFN – DRY Reel of 5000 SN74LVC1G14DRYR CF

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2

has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

FUNCTION TABLE

INPUT OUTPUT

A Y

H L

L H

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, DSF, DRY, and YZP Package)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YZV Package)