Datasheet

A Y
OE
1
2 4
SN74LVC1G126
SCES224P –APRIL 1999–REVISED NOVEMBER 2012 www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Reel of 3000 SN74LVC1G126YZPR _ _ _CN_
free)
SON – DRY Reel of 5000 SN74LVC1G126DRYR CN
µQFN – DSF Reel of 5000 SN74LVC1G126DSFR CN
Reel of 3000 SN74LVC1G126DBVR
SOT (SOT-23) – DBV C26_
–40°C to 85°C
Reel of 250 SN74LVC1G126DBVT
Reel of 3000 SN74LVC1G126DCKR
Reel of 250 SN74LVC1G126DCKT
SOT (SC-70) – DCK CN_
Jumbo Reel
SN74LVC1G126DCKJ
of 10000
SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G126DRLR CN_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
OE A
H H H
H L L
L X Z
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Links: SN74LVC1G126