Datasheet
1
FEATURES
3
2
4
5
1
A
V
CC
Y
B
GND
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
3
2
4
5
1
A
V
CC
Y
B
GND
Seemechanicaldrawingsfordimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G08 performs the Boolean function
A • B or Y = A + B
in positive logic.
SN74LVC1G08-Q1
www.ti.com
......................................................................................................................................................... SCES556F – MARCH 2004 – REVISED APRIL 2008
SINGLE 2-INPUT POSITIVE-AND GATE
• Qualified for Automotive Applications • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Supports 5-V V
CC
Operation
• ESD Protection Exceeds JESD 22
• Inputs Accept Voltages to 5.5 V
– 2000-V Human-Body Model (A114-A)
• Max t
pd
of 3.6 ns at 3.3 V
– 200-V Machine Model (A115-A)
• Low Power Consumption, 10- µ A Max I
CC
– 1000-V Charged-Device Model (C101)
• ± 24-mA Output Drive at 3.3 V
• I
off
Supports Partial-Power-Down Mode
Operation
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G08QDBVRQ1 C08_
– 40 ° C to 125 ° C
SOT (SC-70) – DCK Reel of 3000 SN74LVC1G08QDCKRQ1 CE_
SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G08IDBVRQ1 C08_
– 40 ° C to 85 ° C
SOT (SC-70) – DCK Reel of 3000 SN74LVC1G08IDCKRQ1 CE_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
INPUTS OUTPUT
Y
A B
H H H
L X L
X L L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.