Datasheet
SN74LVC1G08
www.ti.com
SCES217W –APRIL 1999–REVISED JULY 2013
THERMAL INFORMATION
SN74LVC1G08
THERMAL METRIC
(1)
DBV DCK DRL DRY YZP UNITS
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 207.6 283.1 242.9 438.8 130
θ
JCtop
Junction-to-case (top) thermal resistance 145.2 92.3 77.5 276.8 54
θ
JB
Junction-to-board thermal resistance 53.5 60.9 77.5 271.7 51
°C/W
ψ
JT
Junction-to-top characterization parameter 37.5 1.7 9.6 83.8 1
ψ
JB
Junction-to-board characterization parameter 53.1 60.1 77.3 271.4 50
θ
JCbot
Junction-to-case (bottom) thermal resistance – – – – –
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
(1)
MIN MAX UNIT
Operating 1.65 5.5
V
CC
Supply voltage V
Data retention only 1.5
V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7
V
IH
High-level input voltage V
V
CC
= 3 V to 3.6 V 2
V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7
V
IL
Low-level input voltage V
V
CC
= 3 V to 3.6 V 0.8
V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 V
V
O
Output voltage 0 V
CC
V
V
CC
= 1.65 V –4
V
CC
= 2.3 V –8
I
OH
High-level output current –16 mA
V
CC
= 3 V
–24
V
CC
= 4.5 V –32
V
CC
= 1.65 V 4
V
CC
= 2.3 V 8
I
OL
Low-level output current 16 mA
V
CC
= 3 V
24
V
CC
= 4.5 V 32
V
CC
= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate V
CC
= 3.3 V ± 0.3 V 10 ns/V
V
CC
= 5 V ± 0.5 V 5
T
A
Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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