Datasheet

SN74LVC1G08
www.ti.com
SCES217W APRIL 1999REVISED JULY 2013
THERMAL INFORMATION
SN74LVC1G08
THERMAL METRIC
(1)
DBV DCK DRL DRY YZP UNITS
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 207.6 283.1 242.9 438.8 130
θ
JCtop
Junction-to-case (top) thermal resistance 145.2 92.3 77.5 276.8 54
θ
JB
Junction-to-board thermal resistance 53.5 60.9 77.5 271.7 51
°C/W
ψ
JT
Junction-to-top characterization parameter 37.5 1.7 9.6 83.8 1
ψ
JB
Junction-to-board characterization parameter 53.1 60.1 77.3 271.4 50
θ
JCbot
Junction-to-case (bottom) thermal resistance
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
(1)
MIN MAX UNIT
Operating 1.65 5.5
V
CC
Supply voltage V
Data retention only 1.5
V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7
V
IH
High-level input voltage V
V
CC
= 3 V to 3.6 V 2
V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7
V
IL
Low-level input voltage V
V
CC
= 3 V to 3.6 V 0.8
V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 V
V
O
Output voltage 0 V
CC
V
V
CC
= 1.65 V –4
V
CC
= 2.3 V –8
I
OH
High-level output current –16 mA
V
CC
= 3 V
–24
V
CC
= 4.5 V –32
V
CC
= 1.65 V 4
V
CC
= 2.3 V 8
I
OL
Low-level output current 16 mA
V
CC
= 3 V
24
V
CC
= 4.5 V 32
V
CC
= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate V
CC
= 3.3 V ± 0.3 V 10 ns/V
V
CC
= 5 V ± 0.5 V 5
T
A
Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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