Datasheet
www.ti.com
FEATURES
3
2
4
51
NC V
CC
Y
A
GND
DCK PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G07-EP
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES685 – JULY 2007
• Controlled Baseline • Low Power Consumption, 10- μ A Max I
CC
– One Assembly/Test Site, One Fabrication • ± 24-mA Output Drive at 3.3 V
Site
• I
off
Supports Partial-Power-Down Mode
• Extended Temperature Performance of –55 ° C Operation
to 125 ° C
• Latch-Up Performance Exceeds 100 mA Per
• Enhanced Diminishing Manufacturing Sources JESD 78, Class II
(DMS) Support
• ESD Protection Exceeds JESD 22
• Enhanced Product-Change Notification
– 2000-V Human-Body Model (A114-A)
• Qualification Pedigree
(1)
– 200-V Machine Model (A115-A)
• Supports 5-V V
CC
Operation
– 1000-V Charged-Device Model (C101)
• Input and Open-Drain Output Accept
Voltages up to 5.5 V
• Max t
pd
of 5.7 ns at 3.3 V
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
ORDERABLE TOP-SIDE
T
A
PACKAGE
(2)
PART NUMBER MARKING
–55 ° C to 125 ° C SOT (SC-70) – DCK Reel of 3000 SN74LVC1G07MDCKREP CVK
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.