Datasheet

A Y
2 4
A Y
2 4
SN74LVC1G06
SCES295V –JUNE 2000–REVISED NOVEMBER 2012 www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single inverter buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC1G06YZPR _ _ _CT_
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA) _ _ _ _
Reel of 3000 SN74LVC1G06YZVR
0.23-mm Large Bump – YZV (Pb-free) CT
Reel of 3000 SN74LVC1G06DBVR
SOT (SOT-23) – DBV C06_
Reel of 250 SN74LVC1G06DBVT
Reel of 3000 SN74LVC1G06DCKR
–40°C to 85°C
Reel of 250 SN74LVC1G06DCKT
SOT (SC-70) – DCK CT_
Jumbo Tube of
SN74LVC1G06DCKJ
10000
SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G06DRLR CT_
µQFN – DSF Reel of 5000 SN74LVC1G06DSFR CT
QFN – DRY Reel of 5000 SN74LVC1G06DRYR CT
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Table 3. FUNCTION TABLE
INPUT OUTPUT
A Y
H L
L Z
LOGIC DIAGRAM (POSITIVE LOGIC)
DBV, DCK, DSF, DRY, DRL, and YZP PACKAGE
YZV PACKAGE
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Product Folder Links: SN74LVC1G06