Datasheet
A Y
SN74LVC07A
SCAS595T –OCTOBER 1997– REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT OUTPUT
A Y
H H
L L
LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 V
V
I
Input voltage range
(2)
–0.5 6.5 V
V
O
Output voltage range –0.5 6.5 V
I
IK
Input clamp current V
I
< 0 –50 mA
I
OK
Output clamp current V
O
< 0 –50 mA
I
O
Continuous output current ±50 mA
Continuous current through V
CC
or GND ±100 mA
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL INFORMATION
SN74LVC07A
THERMAL METRIC
(1)
(14) PINS UNITS
D DB DGV NS PW RGY
θ
JA
Junction-to-ambient thermal resistance 120.8 135.1 157.7 120.3 151.5 79.4
θ
JCtop
Junction-to-case (top) thermal resistance 79.7 86.7 78.3 76.3 77.6 95.7
θ
JB
Junction-to-board thermal resistance 75.1 82.4 90.8 79 92.3 55.4
°C/W
ψ
JT
Junction-to-top characterization parameter 37.2 43.7 21 36.2 21 16.4
ψ
JB
Junction-to-board characterization parameter 74.8 81.9 90.1 78.7 92.7 55.6
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 34.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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