Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-86867012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
86867012A
SNJ54HCT
373FK
5962-8686701RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8686701RA
SNJ54HCT373J
5962-8686701VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8686701VR
A
SNV54HCT373J
5962-8686701VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8686701VS
A
SNV54HCT373W
JM38510/65453BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65453BRA
JM38510/65453BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65453BSA
M38510/65453BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65453BRA
M38510/65453BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
65453BSA
SN54HCT373J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HCT373J
SN74HCT373DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373
SN74HCT373DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373
SN74HCT373DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373
SN74HCT373DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373
SN74HCT373DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373
SN74HCT373DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT373