Datasheet
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10 Power Supply Recommendations
- 11 Layout
- 12 Device and Documentation Support
- 13 Mechanical, Packaging, and Orderable Information

4
SN54HCT245
,
SN74HCT245
SCLS020F –MARCH 1984–REVISED AUGUST 2016
www.ti.com
Product Folder Links: SN54HCT245 SN74HCT245
Submit Documentation Feedback Copyright © 1984–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 V
I
IK
Input clamp current
(2)
V
I
< 0 or V
I
> V
CC
±20 mA
I
OK
Output clamp current
(2)
V
O
< 0 or V
O
> V
CC
±20 mA
I
O
Continuous output current V
O
= 0 to V
CC
±35 mA
Continuous current through V
CC
or GND ±70 mA
T
J
Operating virtual junction temperature 150 °C
T
stg
Storage temperature –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1500
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±2000
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 V
V
IH
High-level input voltage V
CC
= 4.5 V to 5.5 V 2 V
V
IL
Low-level input voltage V
CC
= 4.5 V to 5.5 V 0.8 V
V
I
Input voltage 0 V
CC
V
V
O
Output voltage 0 V
CC
V
Δt/Δv Input transition rise and fall time 500 ns
T
A
Operating free-air temperature
SN54HCT245 –55 125
°C
SN74HCT245 –40 85