Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-86818012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
86818012A
SNJ54HC
688FK
5962-8681801RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8681801RA
SNJ54HC688J
SN54HC688J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC688J
SN74HC688DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688N ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC688N
SN74HC688NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC688N
SN74HC688PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI -40 to 85
SN74HC688PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688PWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688
SN74HC688PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC688