Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8407101VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8407101VR
A
SNV54HC374J
5962-8407101VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-8407101VS
A
SNV54HC374W
84071012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84071012A
SNJ54HC
374FK
8407101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8407101RA
SNJ54HC374J
8407101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8407101SA
SNJ54HC374W
JM38510/65602BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65602BRA
M38510/65602BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65602BRA
SN54HC374J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC374J
SN74HC374DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374
SN74HC374DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC374