Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-86812012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
86812012A
SNJ54HC
368FK
5962-8681201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8681201EA
SNJ54HC368J
JM38510/65709BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65709BEA
M38510/65709BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65709BEA
SN54HC368J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC368J
SN74HC368D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC368
SN74HC368N ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC368N
SN74HC368NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC368N