Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-88576012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
88576012A
SNJ54HC
21FK
5962-8857601CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8857601CA
SNJ54HC21J
SN54HC21J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC21J
SN74HC21D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21DTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC21N
SN74HC21NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC21N
SN74HC21NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21
SN74HC21NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC21