Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
84089012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84089012A
SNJ54HC
175FK
8408901EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901EA
SNJ54HC175J
8408901FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901FA
SNJ54HC175W
JM38510/65308BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65308BEA
JM38510/65308BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65308BFA
M38510/65308BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65308BEA
M38510/65308BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65308BFA
SN54HC175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC175J
SN74HC175D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175
SN74HC175DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175