Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC165DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74HC165DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC165DR SOIC D 16 2500 364.0 364.0 27.0
SN74HC165DRG3 SOIC D 16 2500 364.0 364.0 27.0
SN74HC165DRG4 SOIC D 16 2500 333.2 345.9 28.6
SN74HC165DRG4 SOIC D 16 2500 367.0 367.0 38.0
SN74HC165PWR TSSOP PW 16 2000 364.0 364.0 27.0
SN74HC165PWRG3 TSSOP PW 16 2000 364.0 364.0 27.0
SN74HC165PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC165PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2013
Pack Materials-Page 2