Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
84095012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84095012A
SNJ54HC
165FK
8409501EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8409501EA
SNJ54HC165J
8409501FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8409501FA
SNJ54HC165W
SN54HC165J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC165J
SN74HC165D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DRG3 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165
SN74HC165DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC165