Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
31-Jan-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8416201VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8416201VC
A
SNV54HC164J
5962-8416201VDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type -55 to 125 5962-8416201VD
A
SNV54HC164W
84162012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84162012A
SNJ54HC
164FK
8416201CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8416201CA
SNJ54HC164J
SN54HC164J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC164J
SN74HC164D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164
SN74HC164N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU | CU SN N / A for Pkg Type -40 to 125 SN74HC164N
SN74HC164N3 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 125
SN74HC164NE3 PREVIEW PDIP N 14 TBD Call TI Call TI -40 to 125 SN74HC164N
SN74HC164NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 SN74HC164N
SN74HC164NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 HC164